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1/4
STRUCTURE PRODUCTSERIES TYPE FUNCTION
Silicon monolithic integrated circuits 3-phase brushless motor driver
BD67922EFV
3-phase MOS direct PWM driver Built-in PLL control circuit Built-in over current protection circuit
Absolute maximum ratings (Ta=25) Item Supply voltage LD, FG applied voltage HB applied voltage Hall signal input voltage Input voltage for CLK pin Input voltage for control pin (SS, SB) Power dissipation Output current Operating temperature range Storage temperature range Junction temperature
1 2 3
Symbol VCC VLD, FG VHB VHALL VCLK VIN Pd IOUT Topr Tstg Tjmax
Limit -0.2+36.0 -0.2+6.5 -0.2+6.5 -0.2+6.5 -0.2+6.5 -0.2+6.5 1.45
Unit V V V V V V W W mA
4.70 2300
-25+85 -55+150 +150
70mmx70mmx1.6mm glass epoxy board. Derating in done at 11.6mW/ for operating above Ta=25. 4-layer recommended board. Derating in done at 37.6mW/ for operating above Ta=25. Do not, however exceed Pd, ASO, and Tjmax=150.
Recommend operating conditions (Ta= -25+85) Item Supply voltage 5V constant voltage output current HB pin current LD, FG pin supply voltage LD, FG pin current Symbol VCC IREG IHB VLD, FG ILD, FG Min. 19 -20 0 0 0 Typ. 24 Max. 28 0 20 5.5 15 Unit V mA mA V mA
This product isn't designed for protection against radioactive rays.
REV. A
2/4 Electrical characteristics (Unless otherwise specified, Ta=25, VCC=24V) Item Whole Circuit current 1 Circuit current 2 VREG output Output voltage Output (U, V, W) Output on resistance Symbol Min. 4.65 Limit Typ. 4.0 1.5 5.00 Max. 9.0 2.3 5.35 Unit Conditions
ICC1 ICC2 VREG
mA mA V
SS=L output ON mode SS=H output OFF mode
RON
-
1.35 1.10 1.10 -
1.76 1.55 1.55 10
V A
Lower side diode forward voltage VD1 0.70 Upper side diode forward voltage VD2 0.70 Output leak current ILEAK Hall comparator Input (HUP, HUN, HVP, HVN, HWP, HWN) Common mode input voltage 1.5 VICM range Hysteresis width VIN 15 LD, FG output Low level output voltage VOD PD output High level output voltage VPDH 4.5 Low level output voltage VPDL Integral amplifier EO High level output voltage VEOH 3.5 EO Low level output voltage VEOL EI input current IEI -2.0 Current limit circuit Drive gain during starting mode GH 1.2 Drive gain during steady mode GL 0.4 Limiter voltage VCL 0.45 CLK input External input frequency FCLK High level input voltage VCLKH 3.0 Low level input voltage VCLKL Low level input current ICLKL -75 Control input (SS, SB) High level input voltage VINH 3.0 Low level input voltage VINL Low level input current IINL -75 OSC OSC oscillating frequency FOSC 130 OSC High voltage VOSCH 1.6 OSC Low voltage VOSCL 1.2 PROCLK CLK cycle for protection circuit TPCLK 13 Hall bias Hall bias voltage VHB 0.70
IOUT=1.0A Sum of upper and lower IOUT=-1.0A IOUT=1.0A
24 0.15 4.9 0.2 4.1 0.9 -0.1 1.5 0.5 0.50 -50 -50 200 2.0 1.5 20 0.85
3.5 42 0.50 0.3 1.5 1.8 0.6 0.55 10 1.5 -25 1.5 -25 270 2.4 1.8 27 1.00
V mV V V V V V A times times V kHz V V A V V A kHz V V msec V Sum of upper and lower ILD, FG=10mA IPD=-100A IPD=100A IEO=-500A IEO=500A VEI=0V
VCLK=0V
VIN=0V COSC =220pF
CPCLK=0.1F IHB=10mA
REV. A
3/4 Package outline Product No. Pin No. / Pin name Pin No. 1 2 3 4 5 6 7 8 9 Lot No. 10 11 12 13 14 HTSSOP-B28 (Unit: mm) Pin name GND VCC FG CS RNF W V U HB HWN HWP HVN HVP HUN Pin No. 15 16 17 18 19 20 21 22 23 24 25 26 27 28 Pin name HUP VREG PD TEST EI EO PROCLK CLK SS LD OSC BRMODE CNF SB
BD67922EFV
Block diagram
HUP 15 HUN 14 HVP 13 HVN 12 HWP 11 HWN 10 CLK 22
2 VCC
HALL HYS COMP
LOGIC
8U 7V 6W
5 RNF PD 17 EI 19 24 LD
EO 20
3 FG
HALL BIAS
CNF 27 OSC 25
9 HB
4 CS
OSC TSD OCP RESET OVLO UVLO Regulator PROOSC
18 TEST 16 VREG 21 PROCLK
BRMODE 26 SB 28 SS 23
1 GND
REV. A
4/4 Operation Notes (1) Absolute maximum ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. (2) Power supply lines As return of current regenerated by back EMF of motor happens, take steps such as putting capacitor between power supply and GND as an electric pathway for the regenerated current. Be sure that there is no problem with each property such as emptied capacity at lower temperature regarding electrolytic capacitor to decide capacity value. If the connected power supply does not have sufficient current absorption capacity, regenerative current will cause the voltage on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the absolute maximum ratings. It is recommended to implement a physical safety measure such as the insertion of a voltage clamp diode between the power supply and GND pins. (3) GND potential The potential of GND pin must be minimum potential in all operating conditions. (4) Metal on the backside (Define the side where product markings are printed as front) The metal on the backside is shorted with the backside of IC chip therefore it should be connected to GND. Be aware that there is a possibility of malfunction or destruction if it is shorted with any potential other than GND. (5) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. This IC exposes its frame of the backside of package. Note that this part is assumed to use after providing heat dissipation treatment to improve heat dissipation efficiency. Try to occupy as wide as possible with heat dissipation pattern not only on the board surface but also the backside. (6) Actions in strong electromagnetic field The IC is not designed for using in the presence of strong electromagnetic field. Be sure to confirm that no malfunction is found when using the IC in a strong electromagnetic field. (7) ASO When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO. (8) Thermal shutdown circuit The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150, and higher, coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to prevent runaway thermal operation. It is not designed to protect or indemnify peripheral equipment. Do not use the TSD function to protect peripheral equipment. (9) Ground Wiring Pattern When using both large current and small signal GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. (10) Mounting errors and Inter-pin short When attaching to a printed circuit board, pay attention to the direction of the IC and displacement. Improper attachment may lead to destruction of the IC. There is also possibility of destruction from shortcircuits which can be caused by foreign matter entering between pins. (11) TEST pin Be sure to connect TEST pin to GND.
REV. A
Notice
Notes
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